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The technical requirements for Sealing Clips continue to evolve to
keep pace with the growing number of new packaging solutions in
the Semiconductor, Hybrid Circuit, and other Electronic
industries
EAS sealing clips are used for a wide array of bonding and sealing
applications in these industries. These include lid/package
sealing, component attach to substrates, substrate attach to
packages, substrate sandwich bonding heat sink attach to packages,
die attach into packages, assembly fixture clamping and various
others.
The design features of EAS clips accommodate the need for
Improved Ergonomics, Higher Force, Lower Force, Lid Side Down
Sealing, and Special Situation Clamping.
EAS continues to develop and manufacture all types of sealing
clips to meet the needs of the industries. In addition to the
general purpose applications, EAS now offers a broad line of clips
with
High Force Ratings and Improved Ergonomic Features. Broader use of polymers for lid/package sealing and substrate
attach has increased the need for
Higher Force Rated Clips.
Sealing Clips Are Available For All Sizes Of The
Following Packages:
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Chip Carriers - Leaded and Leadless
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CQFP (J,U & SOJ types)
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Ball Grid Array
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Pin Grid Array (PGA) - Cavity Up & Cavity Down
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Side Braze
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Miscellaneous Hybrid & Custom Designs
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Custom Designs For Various Substrate Bonding Applications Are
Available
Additional Technical Notes and Free Evaluation Samples are
available upon request for qualified prospects. Please contact us
by phone at 724-838-7023 or by filling out our online contact
form. Click Here
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