technical requirements for Sealing Clamps continues to evolve to keep
pace with the growing number of packaging solutions in the Semiconductor,
Hybrid Circuit & other Electronic Industries.
Wider use of polymers for lid/package sealing and substrate attach has
increased the need for Higher Force Sealing Clips.
to improve the operator handling comfort has increased the need for sealing
clips with Improved Ergonomic Features.
EAS continues to develop and manufacture all types of sealing clips to
meet the needs of the industry. In addition to the general purpose applications,
EAS now offers a broad line of clips with High Force Ratings and
Improved Ergonomic Features.
Clips are available in a force range up to 6.0 lbs. and they can be used
on any style semiconductor package.
Clips Are Available For:
Carriers - Leaded and Leadless
(J,U & SOJ types)
Grid Array Packages (PGA)
Cavity - Down
Cavity - Up
Hybrid Packages & Custom Designs
Additional information and free evaluation samples are available upon
request for qualified prospects.
Contact us by phone at 724-838-7023 or by filling
out our online contact form. Click Here